Open Standard Modules™ (OSM)

Ultra-Compact, Solderable Embedded Modules for Next-Gen Applications

FORTEC Switzerland offers Open Standard Modules™ (OSM) developed according to the manufacturer-independent SGET standard, supported by leading embedded manufacturers. These ultra-compact, solderable BGA modules enable highly efficient, robust, and future-proof system integration in space-constrained environments.

Designed to support ARM, x86, and MCU32 architectures, OSM modules are ideal for industrial sectors where long-term availability, ruggedness, and miniaturization are essential—such as medical technology, automation, transportation, and EV charging infrastructure.

Key Advantages of OSM Modules

BGA solder-on modules for machine assembly
Ultra-flat and space-saving form factor
Future-proof, with standard interfaces and multi-architecture support
Interchangeable across processor generations
Manufacturer-independent open standard (SGET)
Integrated CPU, RAM, and Flash memory
High energy efficiency and mechanical robustness
Designed for long-term availability

Why OSM?

Unlike pluggable standards (SMARC, Qseven, COM Express™, COM-HPC), OSM modules are soldered directly onto the carrier board. This reduces the system height and increases mechanical robustness - ideal for vibration-prone and tight-space environments.

More connection density via BGA
Faster signal transmission due to shorter paths
Increased shock and vibration resistance
Lower production costs through machine assembly

Looking for an ultra-compact embedded solution? Contact FORTEC Switzerland – we’ll help you find the right OSM-based setup for your application.

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