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Compact Fiber Optic Thermometry Converter for Advanced Etch and Deposition

Enhanced Accuracy and Broader Temperature Range for Next-Generation Semiconductor Manufacturing

FORTEC Switzerland presents the Advanced Energy M-1200, the company’s next-generation fiber optic thermometry (FOT) converter, unveiled at SEMICON® West 2025. Designed to deliver exceptional accuracy, durability, and performance, the M-1200 sets a new benchmark for temperature measurement in advanced etch and deposition processes.

Compact, Precise, and Reliable

Engineered for semiconductor OEMs, the M-1200 combines a compact design with the robustness needed to operate reliably in harsh process environments. This enables consistent, repeatable measurements - ensuring high manufacturing quality and yield in semiconductor production.

Smaller and more accurate than most contact-based temperature sensing systems, the M-1200 provides a broad measurement range from -200 °C to +450 °C, making it ideal for the precision demands of next-generation semiconductor fabrication.

Key Features & Advantages

  • Wide temperature range: -200 °C to +450 °C for diverse applications
  • High measurement precision for advanced etch and deposition control
  • Compact form factor for easy integration into space-constrained tools
  • Ultra-fast EtherCAT communication for real-time temperature feedback
  • Flexible probe configurations supporting multiple process requirements
  • Proprietary phosphor formulations for optimized temperature range detection
  • Rugged design built to perform in demanding semiconductor environments

Designed for the Angstrom Era

The M-1200 expands process control capabilities for semiconductor manufacturers entering the Angstrom-Era of ultra-precise materials engineering. Its superior response speed and accuracy enable improved wafer quality, process stability, and yield - helping fabs push the limits of advanced manufacturing performance.

Interested in Advanced Energy’s M-1200 Fiber Optic Thermometry Converter? Contact FORTEC Switzerland to learn more about integration options and how this technology can enhance precision and reliability in your semiconductor applications.


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