congatec Computer-on-Modules With Intel® Core™ Ultra Series 3
Up To 180 TOPS For Edge AI – Compact, Efficient, And Ready For Deployment
congatec expands its Computer-on-Module portfolio with the industry’s broadest range of COMs based on Intel® Core™ Ultra Series 3 processors, enabling powerful embedded AI acceleration without the need for discrete accelerator cards.
With up to 180 TOPS of AI performance, these new modules are designed for energy-efficient, space-optimized edge AI applications, significantly reducing system complexity, power consumption, and BOM costs.
Integrated AI Acceleration For Next-Level Edge Computing
The Intel® Core™ Ultra Series 3 processors combine CPU, GPU, and NPU in a heterogeneous architecture optimized for AI workloads at the edge:
- Up to 16 CPU cores for high-performance computing
- Integrated NPU5 delivering up to 50 TOPS for low-power AI inference
- Up to 12 Xe³ GPU cores providing up to ~120 TOPS for advanced AI acceleration
This architecture enables demanding AI functions such as local NLP and LLM execution, image classification, sensor fusion, and SLAM-without external accelerator hardware.
Wide Module Portfolio Across Multiple Form Factors
congatec offers five new Computer-on-Modules across four form factors, allowing designers to select the optimal balance between performance, size, and I/O bandwidth:
- COM-HPC Mini and COM-HPC Client for maximum performance and high-speed interfaces such as PCIe Gen 5 and USB4
- COM Express Compact modules optimized for rugged or cost-sensitive applications
- COM Express Mini (Type 10) for compact upgrades in existing designs
This flexibility makes the platform suitable for both new developments and seamless upgrades of existing systems.
Designed For Embedded AI Across Industries
The new Intel® Core™ Ultra Series 3-based modules are ideal for AI-enabled systems in:
- Industrial automation and robotics
- Smart cities and transportation
- Medical and healthcare systems
- Retail and intelligent POS solutions
By eliminating discrete accelerators, system designers benefit from lower power consumption, reduced thermal load, and simplified system architectures.
Application-Ready Platforms And Long-Term Support
As part of congatec’s aReady.COM ecosystem, the modules are available as pre-validated, application-ready platforms, including:
- Support for Windows 11, Windows 11 IoT Enterprise, Linux, Yocto, Ubuntu Pro, ctrlX OS, and Kontron OS
- Optional aReady.VT hypervisor for consolidating real-time control, HMI, AI, and IoT workloads on a single module
- Optional aReady.IOT building blocks for IIoT connectivity and cloud integration
Evaluation boards, carrier boards, cooling solutions, and design-in services are available to accelerate time to market.
FORTEC Switzerland supports you throughout the entire project lifecycle - from module selection and system design to integration and long-term availability. Looking to bring embedded AI to the edge without discrete accelerators? Get in touch with us – we’ll be happy to advise you.