congatec COM Express Compact With AMD Ryzen™ AI Embedded P100
Efficient Entry Into Rugged Embedded Edge AI Applications
Edge AI applications increasingly demand high computing performance, deterministic behavior, and low power consumption - often in harsh environments. With the new conga-TCRP1 COM Express Compact module, congatec introduces a scalable embedded platform based on the latest AMD Ryzen™ AI Embedded P100 processor series, designed specifically for industrial edge and AI workloads.
The module delivers up to 59 TOPS of combined AI inference performance, combining CPU, GPU, and NPU acceleration - without the need for discrete AI accelerators.
Balanced CPU, GPU, And NPU Acceleration
The conga-TCRP1 is built on AMD’s latest Zen 5 and Zen 5c architecture, combining performance-oriented and energy-efficient cores within a single processor design. This architecture enables:
- This architecture enables: Deterministic execution timing for real-time applications
- High single-thread performance up to 4.5 GHz
- Optimized performance per watt for cost- and power-sensitive systems
AI workloads are accelerated by the integrated XDNA2 NPU, delivering up to 50 TOPS, while the RDNA 3.5 GPU supports up to four independent 4K displays for advanced visualization.
Rugged Design For Harsh Environments
Designed for industrial and mission-critical use, selected variants of the conga-TCRP1 support an extended temperature range from −40 °C to +85 °C. The configurable TDP from 15 W to 54 W allows system designers to optimize thermal behavior - from passively cooled, sealed devices to performance-oriented systems. This makes the module well suited for: Transportation and railway systems Medical and hygienic PC platforms Smart city infrastructure Robotics and industrial automation Gaming, POS, and interactive systems.
This makes the module well suited for:
- Transportation and railway systems
- Medical and hygienic PC platforms
- Smart city infrastructure
- Robotics and industrial automation
- Gaming, POS, and interactive systems
High Integration And Long-Term Scalability
The module supports up to 96 GB DDR5-5600 memory, optionally with ECC for mission-critical applications. High-speed interfaces such as PCIe Gen4, 2.5 GbE, USB 3.2 Gen2, and SATA enable flexible system expansion and fast data handling.
Supported operating systems include Windows 11, Windows 11 IoT Enterprise, Linux, Ubuntu Pro, ctrlX OS, and Kontron OS. As an aReady.COM, the module can be delivered preconfigured, reducing development effort and accelerating time to market.
FORTEC Switzerland supports the integration of congatec COMs with technical consulting, carrier board selection, cooling concepts, and lifecycle support.