congatec conga-TCRP1
When One Platform Has to Cover Everything
Embedded systems are becoming more complex - but development cycles are expected to get shorter.
Engineers must support multiple performance levels, different applications, and future scalability - often within a single hardware platform.
This is where many designs become inefficient.
With the conga-TCRP1 COM Express Compact modules, congatec delivers a scalable computing platform that allows developers to build entire product families from a single module architecture.
Scale Performance Without Changing the Platform
Traditional embedded designs often require multiple hardware variants to cover different performance needs.
The conga-TCRP1 eliminates this complexity.
It enables:
- seamless scaling from 4 to 12 CPU cores
- flexible GPU scaling from 2 to 16 compute units
- integrated AI performance with up to 50 TOPS
This allows developers to adapt performance levels without redesigning the system.
Built for Edge AI and Real-Time Applications
Modern edge systems require deterministic performance and local processing capabilities.
The conga-TCRP1 is built on:
- AMD “Zen 5” and “Zen 5c” architecture (4 nm)
- Radeon RDNA 3.5 GPU
- XDNA2 NPU for AI acceleration
This combination enables:
- real-time processing of AI workloads
- execution of smaller LLMs locally (without cloud dependency)
- parallel handling of tasks such as image analysis, OCR, and anomaly detection
The result is faster decision-making directly at the edge—with reduced latency and improved data security.
One Module for Multiple Applications
A major challenge in embedded design is covering different use cases with minimal hardware variation.
The conga-TCRP1 supports a wide range of applications, including:
- medical imaging systems (e.g. ultrasound devices)
- industrial machine vision and quality inspection
- smart city infrastructure (traffic monitoring, surveillance)
- robotics and automation systems
- transportation and rugged edge computing
- professional gaming systems
Its scalability allows a single module platform to be used across all these environments.
Designed for Size, Weight, Power, and Cost Optimization
Embedded systems must meet strict SWaP-C requirements.
The conga-TCRP1 offers:
- configurable TDP range from 15 W to 54 W
- support for passive cooling and sealed designs
- high compute density in compact form
This enables precise tuning of performance-per-watt, ensuring optimal system efficiency for each application.
High-Speed Connectivity and System Integration
Modern applications require fast data handling and flexible connectivity.
The conga-TCRP1 provides:
- up to 96 GB DDR5 memory (with optional ECC)
- up to 8 PCIe Gen4 lanes + PEG x4 Gen4
- 2.5 GbE networking
- multiple USB interfaces (USB 3.2 Gen2 and USB 2.0)
- NVMe SSD and SATA storage options
This enables integration into complex systems without additional hardware overhead.
Software Ecosystem for Faster Development
Hardware alone is not enough - software integration defines time-to-market.
congatec supports the conga-TCRP1 with:
- multiple operating systems (Windows, Linux, Ubuntu, ctrlX OS)
- aReady.COM preconfigured modules
- aReady.VT hypervisor technology for workload consolidation
- aReady.IOT tools for connectivity, updates, and device management
This ecosystem reduces development complexity and accelerates deployment.
Key Characteristics
The conga-TCRP1 platform is defined by:
- scalable performance from 4 to 12 CPU cores
- integrated AI acceleration up to 50 TOPS
- configurable TDP from 15 to 54 W
- support for edge AI and real-time applications
- high-speed interfaces and flexible connectivity
- software ecosystem for fast integration
It enables one platform to support multiple product variants - without redesign.
Work with FORTEC Switzerland to integrate scalable congatec platforms into your embedded and edge computing systems.