congatec Computer-on-Modules with Intel® Core™ Ultra Series 3 - Now Rated for -40 °C to +85 °C
Rugged AI Performance for the Most Demanding
Environments Embedded systems deployed in harsh field environments face conditions that standard computing hardware is simply not designed to tolerate: extreme temperature swings, mechanical vibration, weather exposure, and continuous operation over extended periods.
For designers working in industrial automation, robotics, medical technology, and smart retail, the challenge is clear: how to bring powerful on-board AI capabilities to rugged applications without compromising reliability or long-term availability.
congatec addresses this with an expanded range of Computer-on-Modules (COMs) based on Intel® Core™ Ultra Series 3 processors - now available in variants qualified for the full industrial temperature range of -40 °C to +85 °C.
Up to 180 TOPS Across a Full Industrial Temperature Range
The extended-temperature modules deliver up to 180 TOPS of combined AI computing performance, drawing on three acceleration sources within the Intel® Core™ Ultra Series 3 (Panther Lake-H) architecture:
- Up to 16 CPU cores with up to 10 TOPS for general-purpose processing
- Integrated NPU5 for low-power AI inference at up to 50 TOPS
- Up to 4 Xe³ GPU cores for GPGPU-accelerated AI workloads
This combination enables local execution of sensor fusion, real-time control, machine vision, and safety-critical tasks directly at the point of deployment - without cloud dependency. The result is lower latency, stronger data sovereignty, and reduced network load in bandwidth-constrained or security-sensitive applications.
Designed for Applications Where Failure Is Not an Option
The rugged module variants are built for environments where continuous and reliable operation is a fundamental requirement. Key target applications include:
- Mission computers for autonomous and heavy-duty vehicles
- Outdoor edge systems in smart city infrastructure
- Wayside equipment and railway applications
- Energy and renewable sector installations
- Industrial automation and robotics systems
- Medical devices and diagnostic equipment
For projects requiring additional hardening, congatec's aReady.YOURS customization service provides options such as conformal coating, application-specific component selection, and burn-in testing.
Multiple Form Factors for New Designs and System Upgrades
The portfolio covers several module types to support both new developments and the modernization of existing platforms:
- conga-HPC/mPTL (COM-HPC Mini) and conga-HPC/cPTL (COM-HPC Client) - for new designs requiring maximum throughput via PCIe Gen 5 and USB4
- conga-MC1000 (COM Express Type 10 Mini) - credit-card sized module, ideal for upgrading existing Type 10-based mission-critical systems
- conga-TC1000 (COM Express Compact) - for cost-sensitive legacy systems in need of a technology refresh
- conga-TC1000r (COM Express Compact, ruggedized) - screw-locked LPCAMM2 memory for applications with high mechanical stress
Software Ecosystem and OS Support
The modules support a broad range of operating environments, including Windows 11, Windows 11 IoT Enterprise, Ubuntu Pro, Linux, Yocto, ctrlX OS, and KontronOS. As aReady.COMs, they can be delivered pre-configured with licensed OS options.
The aReady.VT virtualization option enables workload consolidation on a single module - combining real-time control, HMI, AI inference, and IoT gateway functions in one platform. For IIoT connectivity, the aReady.IOT software stack with conga-connect supports data exchange, remote management, and cloud connectivity.
congatec's ecosystem further includes carrier boards, cooling solutions, design-in services, and signal integrity documentation to accelerate development and reduce project risk.
FORTEC Switzerland supports your project throughout the full development cycle – from initial module evaluation to series production. Our team provides guidance on module selection, thermal design, and system integration, helping you reduce development effort and bring your product to market efficiently.