Inission Power LPD200 - Semi-Potted AC/DC Power Supplies
200 W in a 1-Inch Low-Profile Package with Conduction Cooling Support
Systems integrators working on audio/video equipment, IT infrastructure, telecommunications, and industrial applications frequently face the same design constraint: high output power is required, but the available space - particularly in height - is severely limited. Conventional power supplies sized for 200 W often exceed what these enclosures can accommodate, and thermal management in sealed or space-constrained housings adds further complexity.
The Inission Power LPD200 series addresses both challenges simultaneously. Delivering up to 200 W in a compact 2.28" × 3.09" × 1.00" semi-potted package, it combines a low 1-inch profile with a baseplate-cooling design that supports conduction heat transfer – making it well suited to installations where heat must be dissipated through a solid thermal path rather than airflow.
Designed for Audio/Video, IT, Industrial, and Telecommunications Applications
The LPD200 series is suited for use across a range of power-demanding, space-constrained application environments, including:
- Wireless backhaul systems including mobile LTE-A and 5G infrastructure
- Desktop 3D scanners and printing systems
- LED signage and lighting systems
- Voice and data centre solutions
- Fibre optics telecommunications equipment
- Video and imaging systems
Technical Characteristics
The LPD200 is engineered to deliver high power density and efficiency within a minimal mechanical envelope:
- Output power up to 200 W with forced-air cooling; from 130 W in free-air convection environments
- Universal AC input voltage range of 85-264 V AC, covering all global grid voltages
- Compact 2.28" × 3.09" × 1.00" (57.9 × 78.5 × 25.4 mm) low-profile semi-potted package
- Power density of 28.4 W/in³
- Efficiency up to 94%
- No-load power consumption below 0.3 W (12 V and 24 V variants) and below 0.4 W (48 V variant)
- Low earth leakage current below 300 µA
- Semi-potted construction with metallic protective cage for mechanical protection of the PCB assembly
- Baseplate design supports conduction cooling for installations where airflow is not available
- Standard output voltages of 12 V, 24 V, and 48 V DC; additional voltages (15 V, 28 V, 30 V, 36 V, 54 V) available on request
- Full set of thermal and electrical protection functions
- Operating altitude up to 5,000 m (OVC II) and up to 2,000 m (OVC III)
- Certified to IEC/EN/UL 62368-1 (latest edition)
- EMC compliant to EN 55032 and CISPR/FCC Class B
- Meets IEC/EN 60335-1 requirements for household appliances
- RoHS-3 compliant (EU Directive 2015/863)
- CE marked, UL Recognition
- IEC Protective Class I
- 5-year manufacturer warranty
Semi-Potted Construction for Flexible Thermal Management
The semi-potted baseplate package is a defining feature of the LPD200 series. In many installation environments - embedded systems, sealed enclosures, wall-mounted equipment, or compact industrial units - convection cooling is insufficient or unavailable. The LPD200's baseplate construction allows heat to be conducted directly into the host chassis or a heatsink, providing an effective thermal path without requiring forced airflow. This flexibility allows the same platform to be used across fanless designs, convection-cooled open frames, and forced-air configurations depending on the available thermal environment.
Combined with 94% efficiency and very low no-load consumption, the series minimises the thermal burden on the host system from the outset, supporting both reliable long-term operation and compliance with current energy efficiency requirements.
FORTEC Switzerland supports you in selecting the right LPD200 configuration for your application - from initial evaluation through to project-specific procurement and long-term series supply.